
Technische Universität
Moore's Law at 60 – Still in Good Shape or Already Ailing?

Technical University of Sofia, Bulgaria
Analyses and techniques of physical failures in packages and systems

Beijing Institute of Technology
Gallium-based oxide semiconductor and devices

Yangtze University
A new water holdup detection method and design of front end digital sensor

North China University of Electric Power and Water Resources
Study on back channel interface control based on ultrathin oxide thin film transistor

Zhengzhou University
Microfluidic and IGZO transistor biosensors for point of care applications

East China Normal University
Cross-Scale In-Situ Defect Detection Technology for Advanced Semiconductor Devices

University of Kaohsiung, Taiwan
A Unified Ballistic Device-Physics-based Subthreshold Current/Swing Model for Modern Multiple-gate Transistors

Zhejiang University
high-frequency broadband high power capacity BAW RF filter technology

Zhengzhou University
First-Principles Investigation of h-BN Growth on Diamond and Its Heterostructure Properties

Hangzhou Dianzi University
Power Circuits in Microwave Wireless Power Transmission Systems

The Chinese University of Hong Kong
Flexible and Stretchable Electronics Enabling the Future of Wearable Technology

Hong Kong University of Science and Technology
Lithium Niobate aspire to 5G and 6G wireless communications

Nanjing University
Reliability of NiO/Ga2O3 p-n heterojunction power diodes

Hefei University of Technology
Robust Digital Circuit Designs Protected Against Soft Errors

Guangzhou Xinfeng Technology Company
Chip Design By HLS EDA, further AI-Powered EDA

Kunshan Xiangwei Microelectronics Technology Co., LTD.,
Chip Interconnect Technology

Jiangnan University
The Integrated ESD and EOS Protection for Improving the IC Reliability

University of Electronic Science and Technology of China
1500V High-Voltage GaN HEMT Device with Multiple Field Plates for High Power Applications

City University of Hong Kong
Contacts in Nanoscale and Contacts for Nanomaterials

China Electronics Technology Group Corporation Chip Research Institute
ESD Protection Co-Design with Core and I/Os for a High Voltage Power Controller

University of Electronic Science and Technology of China
SCR Designs for Effective ESD Protection in Nanoscale Low-Voltage lCs

Nagoya University
Magnesium intercalation in gallium nitride for enhanced p-type doping and device performance

RIKEN Institute, Japan
Progress in 230nm High-Power AlGaN Far-UVC LED Module for use as Human-Harmless Virus Inactivation

Shandong University of Science and Technology
Improving the usability of flexible force sensing devices by combining artificial intelligence algorithm

Hong Kong University of Science and Technology (Guangzhou)
CMOS Single Photon Avalanche Diodes for Biomedical Imaging Applications

Tianjin University
Recent Progress of Silicon based mm-wave and THz Integrated Circuits and Systems

Hunan University
Covert Performance Analysis of RIS-aided Wireless Communication Systems

Zhejiang University
Towards Deterministic Low-Latency Communications: A Stochastic Optimization Perspective

ZhengZhou University
MEMS-Based Intelligent Sensors and AI Algorithms for Smart City IoT